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U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
USA Insight 24/7
July 09, 2024
The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.
from NYT > Top Stories https://ift.tt/rD6MyZK
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